MediaTek Unveils Dimensity 7300 and 7300X Chipsets

MediaTek has announced the release of its latest chipsets, the Dimensity 7300 and Dimensity 7300X, designed to deliver top-tier power efficiency and performance for high-tech mobile devices.

These new 4 nm chips promise to enhance multitasking, photography, gaming, and AI-driven computing. Additionally, the Dimensity 7300X is designed specifically for foldable phones with enhanced dual-screen support.

Dimensity 7300 and Dimensity 7300X Core Specifications

The Dimensity 7300 series stands out with its octa-core CPU, featuring 4 Arm Cortex-A78 cores running up to 2.5 GHz alongside 4 Arm Cortex-A55 cores. This configuration, combined with the advanced 4 nm process, results in up to 25% lower power consumption for the A78 cores compared to the earlier Dimensity 7050 chipset.

The CPU is complemented by the latest Arm Mali-G615 GPU and MediaTek’s HyperEngine optimizations, delivering a 20% boost in FPS and energy efficiency compared to competitors.

Dimensity 7300 series Photography and Video Features

The Dimensity 7300 chipsets come with the MediaTek Imagiq 950, a 12-bit HDR-ISP supporting up to a 200MP main camera. This advanced image processor offers precise noise reduction, face detection, and video HDR, enabling users to capture high-quality images and videos even in challenging lighting conditions.

Compared to the Dimensity 7050, the new chipsets offer up to 1.3X faster live focus photo performance and up to 1.5X faster photo remastering, along with 4K HDR video recording capabilities with over 50% wider dynamic range than competitor solutions.

Dimensity 7300X AI enhancements

The MediaTek APU 655 integrated within the Dimensity 7300 series significantly boosts AI task efficiency, doubling the performance of its predecessor, the Dimensity 7050.

This enhancement allows for more efficient use of memory bandwidth and reduced memory requirements for larger AI models, making complex AI tasks more manageable on mobile devices.

Related: Meditek launches Dimensity 9300+; clocks at 3.4GHz with improved efficiency

Display Features

Equipped with MediaTek’s MiraVision 955, the Dimensity 7300 SoCs support WFHD+ displays with 10-bit true color and global HDR standards, enriching media streaming and playback experiences.

The Dimensity 7300X further enhances device functionality with dedicated support for dual displays in foldable phones, catering to the growing demand for innovative mobile form factors.

Dimensity 7300 Connectivity features

MediaTek’s new chipsets are built with gamers in mind. They incorporate smart resource optimization and advanced connectivity features to ensure smooth, responsive gameplay. The chips optimize 5G and Wi-Fi connections and support Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio.

Additionally, the Dimensity 7300X is tailored for flip-style foldable devices, offering support for dual displays, a feature that promises to inspire innovative designs in the mobile market.

Related: Snapdragon 8s Gen 3 Officially Launched; What’s Different About it?

5G and Wi-Fi Capabilities

Both chipsets incorporate MediaTek 5G UltraSave 3.0+ technology, which offers substantial power savings in 5G sub-6 GHz connectivity scenarios, improving efficiency by 13-30% over competitors.

They also support up to 3.27 Gb/s 5G downlink speeds via 3CC carrier aggregation, ensuring faster data transfer in urban and suburban areas. Additionally, tri-band Wi-Fi 6E support provides reliable multi-gigabit wireless connectivity, while dual 5G SIM support with dual VoNR offers users greater flexibility.

The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game. Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business

MediaTek Dimensity 7300 and 7300X SoCs Availability

Motorola is poised to integrate the Dimensity 7300X 5G into its upcoming Motorola Razr 50 clamshell foldable smartphone. The device recently appeared on Geekbench, achieving scores of 1033 in single-core and 2751 in multi-core tests.

Additionally, OPPO is anticipated to launch the global variant of the OPPO Reno 12 5G featuring the standard Dimensity 7300 SoC.

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