Intel’s next mobile generation, Panther Lake, will ship with a new Core Ultra X tier—X9, X7, and X5—now enumerated in HWMonitor v1.60 alongside regular H- and U-series parts, confirming earlier rumors about the “X” branding at the top of the stack.
The X-branded H chips pair a 4P+8E+4LPE CPU complex with a larger Xe3 iGPU of up to 12 Xe cores, while mainstream H and efficiency‑first U parts carry smaller 4‑Xe3 iGPUs and, for U, no E‑cores, aligning with Intel’s 18A-based platform rollout timing into early 2026.

What’s new with Intel Panther Lake
Intel’s “X” badge cleanly marks the H-class models with the bigger 12‑Xe3 integrated GPU and higher platform ceilings, differentiating them from 4‑Xe3 mainstream configurations in the same 4P+8E+4LPE CPU envelope.
The HWMonitor update lists specific X9/X7/X5 model strings, giving OEMs and software tools early identifiers for enablement ahead of retail availability. Intel, meanwhile, has positioned Panther Lake as its first AI PC platform on the Intel 18A node with initial shipments before year‑end and broader retail availability slated for January 2026.
Lineup overview
Intel’s mobile stack splits into three visible tiers in the HWMonitor list: Core Ultra X (H), Core Ultra (H), and Core Ultra (U).
At the top, X-tier H parts pair the 4P+8E+4LPE CPU structure with the full 12‑Xe3 iGPU, while non‑X H parts retain the same CPU complex but step down to a 4‑Xe3 iGPU for mainstream designs. The U-series focuses on efficiency with 4P+LPE, no E‑cores, and a 4‑Xe3 iGPU for thin‑and‑light laptops.
Core Ultra X (H)
- Core Ultra X9 388H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 12 Xe3 cores.
- Core Ultra X7 368H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 12 Xe3 cores.
- Core Ultra X7 358H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 12 Xe3 cores.
- Core Ultra X5 338H: 4 P-cores, 4 E-cores, 4 LP‑E cores, 10 Xe3 cores.
Core Ultra (H)
- Core Ultra 9 375H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 7 355H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 7 345H: 4 P-cores, 8 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 5 325H: 4 P-cores, 4 E-cores, 4 LP‑E cores, 4 Xe3 cores.
Core Ultra (U)
- Core Ultra 7 360U: 4 P-cores, 0 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 5 350U: 4 P-cores, 0 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 5 340U: 4 P-cores, 0 E-cores, 4 LP‑E cores, 4 Xe3 cores.
- Core Ultra 3 320U: 2 P-cores, 0 E-cores, 4 LP‑E cores, 4 Xe3 cores.
Also Read: Intel unveils Panther Lake Architecture – 18A: Laptop Chip to prove Intel Still Has Fight Left
Architecture and graphics
Panther Lake debuts Intel’s client platform on the Intel 18A process, combining new CPU tiles, Arc Xe3 graphics, and updated packaging for efficiency and AI acceleration across thin‑and‑light to performance notebooks.
The Xe3 iGPU scales up to 12 cores in the X-tier and targets a 50%+ uplift versus Xe2/Lunar Lake-class integrated graphics, signaling a notable bump for integrated gaming and creator workflows. Platform configurations also scale memory bandwidth and features by tier, with the X-series positioned for the fastest memory subsystem among the listed mobile parts.

Availability
Intel indicates initial Panther Lake SKUs will ship before the end of 2025, with broader retail availability set for January 2026 as 18A ramps into volume for client systems. This cadence aligns with OEM notebook refresh windows across H and U classes, with X-tier designs expected to headline early configurations due to their larger iGPU and platform ceilings.
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