Samsung has recently commenced mass production of the world’s thinnest LPDDR5X DRAM packages, available in 12GB and 16GB capacities. These advanced memory solutions boast a thickness of only 0.65 millimeters, making them the slimmest in the industry.
The reduction in thickness, by approximately 0.06 millimeters compared to conventional LPDDR5X modules, is achieved through a new packaging technique that includes optimized printed circuit board (PCB) designs and epoxy molding compound (EMC) methods.
These LPDDR5X DRAM packages employ a 4-stack structure and utilize a specialized back-lapping process, which further reduces the package height. This ultra-thin design not only facilitates better airflow within devices, enhancing thermal management but also supports high-performance applications, including those with advanced on-device AI capabilities.
According to Samsung, the new 0.65mm LPDDR5X packages offer 9% thinner dimensions and 21.2% better heat resistance compared to the previous generation.
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YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, emphasized that the new LPDDR5X DRAM sets a new benchmark for high-performance on-device AI solutions.
Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package.
While these advancements significantly contribute to the potential for slimmer smartphones, they are part of a broader strategy. Smartphone manufacturers will likely combine these ultra-thin memory solutions with other techniques, such as using thinner protection glass, more compact printed circuit boards, and slimmer batteries, to achieve overall thinner devices.
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Looking ahead, Samsung plans to expand its LPDDR5X offerings with even more advanced configurations. The company is working on developing 6-layer 24GB and 8-layer 32GB modules, which will continue to push the boundaries of memory performance and package compactness, although specific thickness details of these future modules have not been disclosed yet.
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